Flir C2 thermal imaging of SA818 radio node


            

Today I did some thermal measurements with my Flir C2. These values were taken on Tx during a radio dialogue between two hams. The node was continuously transmitting for several minutes in a row. To me it seems it runs a bit too hot so I have to imagine a cooling solution for the node. What is interesting is that it seems that the most heat is dissipated by the processor not by the SA818 module. This design has a ground pad that should be thermally connected with the corresponding pad of SA818 (low thermal resistance) with some thermal paste. I did not do that, so I wonder if this will improve the thermal profile. Time will tell, but definitely all these will be included in my next project.

Raspberry Pi compatible, SA818 radio node

My new radio node that I designed last month is back from production at jlcpcb. Designed in Romania and built in China 😁. This is my first attempt using jlcpcb for the entire manufacturing chain, from PCB creation to part selection and assembly.

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